Egypt Zones accountACCOUNT

Senior Process Engineer


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Education: 4
Experience: 6 years
Relocation: Yes - Internationally

Industry Experience
6 years Sr. Electrical Engineer

Career Objective

I am very keen to join the oil and gas industry where I will be able to make a contribution in the unprecedented levels of exploration and production activities, in meeting today's soaring energy demand.

Professional Experience

6 years in the electronics industry, covering management and process engineering for semiconductor manufacturing and technology development for hard disk drives.

Current Position: Senior Engineer, Product Development,
Western Digital

Involved in hard disk development, including product testing, analysis and deployment for mass production.

• Perform failure analysis on failed disk drives to determine root causes.
• Coordinate with lab and process teams to develop solutions for failed drives.
• Manage and develop code packages for disk drive optimisation with software development team.
• Manage and coordinate junior product development team

Nov 2004 – May 2008: Senior Process Engineer, Front of Line-
Die Attach Operation, STATS ChipPAC

Led a team of junior engineers and technicians in the die attach process for semiconductor packaging and improvement of assembly yield.

• Frequent dealings with material and equipment vendors on improvement/enhancement which involves designing jigs, specialized tools and software upgrades.
• Designed process controls and specifications and in-house controls using Statistical Process Control tools such as JMP.
• Managed a team of technical experts on project basis in improving the Die Attach process.
• Liased with Customer Support and Production teams on yield improvement as well as supporting specific customer requirements.
• Frequently presented projects on a continual update basis to customers, management and internal board of directors

Jan 2003 – Oct 2004: Process Engineer, Front of Line-
Die Attach Operation, Unisem (M) Berhad

Controlled die attach processes in semiconductor packaging and improvement of assembly yield, designing and sourcing for improved / modified machine hardware and providing solutions for specific customer requirements


• Troubleshoot and provided immediate solutions for machine problems
• Increased machine capability and Overall Equipment Efficiency
• Enhanced process yield and control variations in assembly to a minimum according to department policies and specifications as well as customer requirements.
• Worked in a team with Production, Maintenance and Equipment groups to further increase machine performance

Eductation

EDUCATION

Bachelor’s of Mechatronics Engineering
Universiti Teknologi Malaysia
Graduated in October 2002

Thesis: Automated Guided Vehicle software using Visual Basic 6.0

Industrial Training at APMI Sdn Bhd, which focuses on manufacturing and testing of vehicle harnesses.

Certification

MAJOR ACHIEVEMENTS

• Received certificate of appreciation from Stats Chippac Malaysia in yield performance for the company’s major customer.
• Led a team that qualified a major electronic firm (Intel) as Stats Chippac’s number one customer.



Additional Information

Married, Malaysian, 28 years old

LANGUAGES

Fluent in English and Malay (written and spoken)
Fluent in Punjabi (spoken)

COMPUTER SKILLS

Visual Basic, P-Spice, Matlab, JMP (Statistical Process Tool), Microsoft Office

Hot Categories

Chemicals Batteries

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